Achievement of high volumes in micro parts with the disk laser

>> Application Note

The size of components in power electronics are reduced in half virtually each year. With the booming sales figures in consumer electronics the production volumes of the highly constant ceramics based inductivities which are need for circuit boards and electronic components also significantly increase. These micro components are usually micro structured with a laser and then separated.

The disk laser allows for economical production thanks to its high processing speeds and very minimal post processing requirements. With the help of the very high pulse to pulse intensity the unfavourable absorptional threshold in infra red wavelengths can quickly be overcome in oxide ceramics. The appropriately chosen pulse energy and the defined duty cycle initiate a controlled cutting or structuring process. This is a significant advantage of Q-switching with conformable pulse intermission.

Constant scribing depths and dimensions being within tolerance significantly reduce rejects and post processing costs. Industrial applications in scribing of ceramics were realized with disk lasers and corresponding machine concepts with feed rates of 10,000 mm per minute and cutting kerfs of approximately 8 µm. Typical fields of application in the electronics sector are micro perforating of circuit boards, cutting and structuring of ceramics and ceramic substrate carriers, tapped blind holes in circuit boards and components, structuring, cutting and drilling of copper foils.

The advantages of the disk laser in electronics applications at a glance:

•   High volumes and process speeds
•   Reduced heat affected zones HAZ on electronics componentry
•   Intricate structures possible
•   High pulse to pulse stability
•   Smallest beam entry diameters
•   Low operating costs

Ceramic substrate after laser cutting

Ceramic substrate after laser scribing with cutting kerf of 8 µm

Cutting pattern in Si-ceramic of
1 mm thickness